Performance Analysis of GaN/AlGaN HEMTs Passivation using Inductively Coupled Plasma Chemical Vapour Deposition and Plasma Enhanced Chemical Vapour Deposition Techniques

Sunil Kumar, Amit Malik, Dipendra Singh Rawal, Seema Vinayak, Hitendra Malik

Abstract


In the present paper SiN thin film has been studied as a passivation layer and its effect on AlGaN/GaN HEMTs is investigated using two different deposition techniques i.e PECVD and ICPCVD. AlGaN/GaN HEMTs devices passivated with optimised SiN film have delivered lower gate leakage current (from μA to nA). Device source drain saturation current (Ids) increased from 400mA/mm to ~550 A/mm and the peak extrinsic trans-conductance increased from 100 mS/mm to 170 mS/mm for a 0.8 μm HEMT device. The optimised SiN passivation process has resulted in reduced current collapse and increased breakdown voltage for HEMT devices. 


Keywords


GaN; Passivation; SiN; Plasma enhanced chemical vapour deposition; PECVD; Inductively coupled plasma chemical vapor deposition; ICPCVD

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DOI: http://dx.doi.org/10.14429/dsj.68.12329



Defence Science Journal (DSJ)