Preparation and Optimization of Pyrophosphate Bath for Copper Electroplating of Microwave Components

  • L. G. Bhatgadde Indian Institute of Technology Bombay, Mumbai
  • S. Mahapatra Indian Institute of Technology Bombay, Mumbai
Keywords: Copper deposition, Pyrophosphate electrolytes, Copper pyrophosphate, Plating bath

Abstract

The principles of copper deposition from pyrophosphate electrolytes have been explained. Based on these principles, a method  of preparation of plating bath from basic constituents has been described. It was found that copper pyrophosphate is precipitated from solutions of copper sulphatc and potassium pyrophosphate at a pH of 5.0. For maximum efficiency, copper pyrophosphate has to be disolved in potassium pyrophosphate in a weight ratio of 1 : 4 or a total P2o7,: Cu ratio of 7.5 : 1. By using optimum values of anode : cathode area,2.5, pH, 5.0, temperature, 55°C and a cathode curfent density of 0.8 A/dm2, bright, adherent copper electroplates were deposited on electroless copper plated Al2o3, substrates employed in microwave components.

References

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Published
2013-04-01
How to Cite
Bhatgadde, L., & Mahapatra, S. (2013). Preparation and Optimization of Pyrophosphate Bath for Copper Electroplating of Microwave Components. Defence Science Journal, 38(2), 119-123. https://doi.org/10.14429/dsj.38.4830
Section
General Papers