Preparation and Optimization of Pyrophosphate Bath for Copper Electroplating of Microwave Components
Abstract
The principles of copper deposition from pyrophosphate electrolytes have been explained. Based on these principles, a method of preparation of plating bath from basic constituents has been described. It was found that copper pyrophosphate is precipitated from solutions of copper sulphatc and potassium pyrophosphate at a pH of 5.0. For maximum efficiency, copper pyrophosphate has to be disolved in potassium pyrophosphate in a weight ratio of 1 : 4 or a total P2o7,: Cu ratio of 7.5 : 1. By using optimum values of anode : cathode area,2.5, pH, 5.0, temperature, 55°C and a cathode curfent density of 0.8 A/dm2, bright, adherent copper electroplates were deposited on electroless copper plated Al2o3, substrates employed in microwave components.References
Lowenheim, F.A., Electroplating (McGraw Hill Book Co., New York), 1978, pp. 194-204.
Anthony, S. & Ramualdas, B., Metal Finishing Guide Book and Directory (Metals and Plastics Publications, Inc., N.J.), 1986, pp. 217-219.
Seliverstov, V.P., Zzv. Vyssh. Uchebn. Zaved. Khim Teknol, 26 (1983), 883-884.
, Minakawa, Todashi, et al., Japanese Patent, 78, 109, 826, 1978.
Loschkarev, M.A., et al. , Vapr. Khim. Khim. Tckhnol, 56 (1979), 55-58.
Pilavov, Sh. G., & Egarova, A.L., Zashch. Met., 13 (1977), 734-73.
Raljewicz, Z. et al., Polish Patent, 120, 289, 1983.
Where otherwise noted, the Articles on this site are licensed under Creative Commons License: CC Attribution-Noncommercial-No Derivative Works 2.5 India