Equivalent Stress Approach to Life Prediction of Creeping Solids with Initial Defect

  • V. M. Radhakrishnan Indian Institute of Technology Madras, Chennai
  • V. V. Balasubramaniam A U College of Engineering, Visakhapatnam
Keywords: Fabrication, Elevated temperature

Abstract

High temperature components contain many crack like defects introduced during the fabrication processes. These defects will grow during service under the action of applied stress and elevated temperature. An equivalent stress approach has been developed in this paper which can be effectively used to predict the life of defective materials under creep conditions.

Author Biographies

V. M. Radhakrishnan, Indian Institute of Technology Madras, Chennai
Metallurgical Engineering Department, Indian Institute of Technology Madras, Chennai
V. V. Balasubramaniam, A U College of Engineering, Visakhapatnam

Metallurgical Engineering Department, A U College of Engineering Visakhapatnam

 

Published
2013-01-01
How to Cite
Radhakrishnan, V., & Balasubramaniam, V. (2013). Equivalent Stress Approach to Life Prediction of Creeping Solids with Initial Defect. Defence Science Journal, 41(4), 409-416. https://doi.org/10.14429/dsj.41.4443
Section
Materials Science & Metallurgy