3-D MCM Technology for Miniaturisation of an Electronic System
Keywords:
Miniaturisation, MCM technology, SIP, SOC, multi-chip module, system-in-a-package, system-on-a-chip, electronic systems, packaging technology, 3-D technology, system miniaturisation, tape-automated bonding
Abstract
Miniaturisation of a bulky system requires effective use and integration of modern packagingtechnology to achieve smaller size and lighter weight while consuming low power and achieving
high speed. Using three-dimensional packaging technology, a system can be miniaturised to a
small package popularly known as system-in-a-package (SIP). Various layers of component
integration (die or packaged) in the horizontal and vertical directions lead to a compact system
in a single package. In this paper, the development of an analog multi-chip module (MCM) is
illustrated using 3-D technology. The major goals achieved using this technology are the mixedsignal
integration, arealsize reduction, and low power. A comparison is made with the systemon-
a-chip (SOC) technology and their merits and demerits are also discussed.
Published
2006-01-01
How to Cite
Bhowmick, S. K. (2006). 3-D MCM Technology for Miniaturisation of an Electronic System. Defence Science Journal, 56(1), 47-52. https://doi.org/10.14429/dsj.56.1868
Section
Special Issue Papers
Copyright (c) 2016 Defence Science Journal
Where otherwise noted, the Articles on this site are licensed under Creative Commons License: CC Attribution-Noncommercial-No Derivative Works 2.5 India