Implementation of Peltier Cooling in Hermetically Sealed Electronic Packaging Unit for Sub-sea Vessel

  • Madhavan Nampoothiri S. DRDO-Naval Physical and Oceanographic Laboratory, Cochin - 682 021
  • Sabu Sebastian M. DRDO-Naval Physical and Oceanographic Laboratory, Cochin - 682 021
  • Sajith Kumar P.C. DRDO-Naval Physical and Oceanographic Laboratory, Cochin - 682 021
Keywords: Hermetically sealed electronic packaging unit, Conduction cooling, Peltier cooling, Sub-sea vessel, FloTherm

Abstract

This paper presents the methodology adopted for implementation of Peltier cooling in hermetically sealed electronic packaging units used in sub-sea vessels. In sub-sea vessels, sonar front-end electronics is packaged in hermetically sealed electronic packaging units. The thermal design of the unit is a highly challenging task considering the heat dissipation of 300W from the electronics, non-availability of chilled air for cooling and IP68 sealing requirements. Cooling fans cannot be integrated, since these units are to be placed in acoustically sensitive pressure capsule area of the subsea vessel. The electronic cooling in this unit is achieved using conduction cooling with external fins. To enhance the cooling, suitable Peltier cooling (Thermo-electric cooling or TEC) module is selected and implemented with the system. Computational fluid dynamic analysis of the unit is carried-out to study the air-flow and thermal performances with Peltier cooler. The unit is realised and the estimated temperatures validated by experimental temperature measurements on the realised unit. The measured temperatures are within the safe operating limits of the electronic components and hence the cooling design of the unit is satisfactory. It is also observed that maximum temperature reduction has occurred at 1.5A current and card edge temperature of Printed circuit board lowered by 9.28 °C by implementing Peltier cooling.

Author Biographies

Madhavan Nampoothiri S., DRDO-Naval Physical and Oceanographic Laboratory, Cochin - 682 021
Mr Madhavan Nampoothiri S. obtained his BTech(Mechanical Engineering) from TKM College of Engineering, Kollam and MTech(Thermal Science) from NIT, Calicut. Presently working as Scientist at DRDO-Naval Physical and Oceanographic Laboratory, Kochi. His areas of research include electronic cooling and packaging of sonar electronics for ship, submarine and air-borne applications. He is a recipient of DRDO Young Scientist Award 2016.
Sabu Sebastian M., DRDO-Naval Physical and Oceanographic Laboratory, Cochin - 682 021
Dr Sabu Sebastian M. received his PhD from Indian Institute of Technology, Madras, in 2011. Presently working as Scientist and Director of Engineering Group at DRDO-Naval Physical and Oceanographic Laboratory, Kochi, India. His research interests include vibration isolation, noise reduction, electronic packaging and structural design. He has authored/co-authored more than 25 publications including international journals and conference papers.
Sajith Kumar P.C., DRDO-Naval Physical and Oceanographic Laboratory, Cochin - 682 021
Mr Sajith Kumar P.C. obtained his BTech (Mechanical Engineering) from College of Engineering, Trivandrum and MTech (Mechanical Engineering) from IIT, Madras. Presently working as Scientist and heading the Structural and Thermal Engineering Division at DRDO-Naval Physical and Oceanographic Laboratory, Kochi, India. His areas of interest include hydrodynamics of underwater structures and electronic packaging for sonar application.
Published
2018-04-16
How to Cite
S., M., M., S., & P.C., S. (2018). Implementation of Peltier Cooling in Hermetically Sealed Electronic Packaging Unit for Sub-sea Vessel. Defence Science Journal, 68(3), 326-332. https://doi.org/10.14429/dsj.68.12149
Section
Naval Systems