Microencapsulation of Paraffin Wax Microspheres with Silver

  • Kh. Gopal Krishna Singh Department of Mechanical Engineering, National Institute of Technology, Silchar - 788 010
  • Sudipta Halder Department of Mechanical Engineering, National Institute of Technology, Silchar - 788 010
  • Sukumar Pati Department of Mechanical Engineering, National Institute of Technology, Silchar - 788 010
  • Jialai Wang Department of Civil, Construction and Environmental Engineering, The University of Alabama, AL 35487
Keywords: Microencapsulation, paraffin wax, Metallic shell material, Microelectronic thermal management

Abstract

Microencapsulation of phase change materials (PCMs) with metallic shell materials is a very innovative and challenging task. This can mitigate the problems related to thermal barrier for conventional nonconductive shell materials as well as enhance mechanical properties of PCM microcapsules. Such microcapsules can be integrated into microelectronic devices for their intermittent thermal management in mission critical components. The present work is aimed at developing a new method to synthesise phase change material encapsulated with metallic shell material and characterising the same. Paraffin wax microspheres were first synthesised and then encapsulated with silver through in situ chemical reduction. Further more, a new set of experiments were identified to analyse the quality of encapsulation. The thermal properties were investigated under differential scanning calorimeter and thermogravimetric analyser. The average diameter of paraffin wax microspheres (PW) is found to be ±329 μm. It reveals from DSC analysis that the enthalpy of fusion is minimum for PW@Ag-PVA amongst all others. Accordingly, higher deposition of Ag is possible for PW@Ag-PVA. This is also supported by TGA results where PW@Ag-PVA has only 40 per cent mass loss and the remaining samples have 100 per cent. However, even for PW@Ag-PVA the encapsulation is found incomplete. The present work provides knowhow of the difficulties associated with encapsulation of PCMs with metallic shell material.

Author Biographies

Kh. Gopal Krishna Singh, Department of Mechanical Engineering, National Institute of Technology, Silchar - 788 010
Kh. Gopal Krishna Singh obtained his BTech (Mechanical Engineering) from Government Engineering College, Trissur, Kerala, in 2010 and MTech (Manufacturing Science and Engineering) from Sidaganga Institute of Technology, in 2012. Presently pursuing his PhD from department of Mechanical Engineering at National Institute of Technology (NIT) Silchar, India.
Sudipta Halder, Department of Mechanical Engineering, National Institute of Technology, Silchar - 788 010
Dr Sudipta Halder, obtained his MTech (Materials Engineering) from IIEST Shibpur, and PhD from Metallurgical and Materials Engineering Department, IIT Roorkee. He did his post-doctoral from Department of Center for Sustainable Infrastructure Civil, Construction and Environmental Engineering at The University of Alabama, USA. Presently working as an Assistant Professor, Department of Mechanical Engineering, National Institute of Technology Silchar.
Sukumar Pati, Department of Mechanical Engineering, National Institute of Technology, Silchar - 788 010
Dr Sukumar Pati, received his BE (Mechanical Engineering) from the University of North Bengal, and PhD from Mechanical Engineering Department, Indian Institute of Technology Kharagpur, India. Currently working as Assistant Professor in the Department of Mechanical Engineering at National Institute of Technology (NIT) Silchar, India. His field of expertise is thermal science and engineering. He has published several research papers in peer-reviewed international journals of repute. He is the co-author of the three textbooks.
Jialai Wang, Department of Civil, Construction and Environmental Engineering, The University of Alabama, AL 35487
Dr Jialai Wang, received his PhD from the Department of Civil Engineering at University of Akron, in 2003. He is currently Professor in the Department of Center for Sustainable Infrastructure Civil, Construction and Environmental Engineering at The University of Alabama. His research area consists of Sustainable infrastructure materials, nanotechnology and its applications in advanced structural composites, structural renewal/rehabilitation, thermal active materials and deterioration science at bi-material interface.
Published
2018-03-13
How to Cite
Singh, K., Halder, S., Pati, S., & Wang, J. (2018). Microencapsulation of Paraffin Wax Microspheres with Silver. Defence Science Journal, 68(2), 218-224. https://doi.org/10.14429/dsj.68.11410
Section
Materials Science & Metallurgy