High Performance Interconnection Technology in Avionics (Short Communication)

C. R. Raghunath; Punya Prabha V.; H. S. Yeshaswini; H. Rashmi; T. N. Sushma

doi:10.14429/dsj.61.1085

C. R. Raghunath M.S. Ramaiah Institute of Technology, Bengaluru
Punya Prabha V. M.S. Ramaiah Institute of Technology, Bengaluru
H. S. Yeshaswini M.S. Ramaiah Institute of Technology, Bengaluru
H. Rashmi M.S. Ramaiah Institute of Technology, Bengaluru
T. N. Sushma M.S. Ramaiah Institute of Technology, Bengaluru

DOI: https://doi.org/10.14429/dsj.61.1085

Keywords: Avionics, integrated circuits, large-scale integrated circuits, packaging technology, system-on-chip, laminates systems, interconnection technology

Abstract

Avionics subsystems continue to get smaller and more functional, driving the total circuit package itself to become denser, causing the printed wiring board (PWB) to evolve new laminates to meet these needs. There is a continuous scope for improvement to match the requirement of wireability demand from high density and high speed integrated circuits. Development of control processing units and rapid expansion of memory device capabilities were realised by the development of large-scale integrated circuits and other electronic devices with higher integration and with new functionalities. Enormous efforts have been put on the development of the system-on-chip (SOC), where a single semiconductor chip constituting complete system is bonded on substrate. These innovations in packaging technology made a big impact on laminates used in printed circuit boards. Aircraft systems are expected to withstand disturbances due to unexpected threats. Under such situations, passengers' safety, emergency landing and timely information to pilot become of paramount importance, hence, new innovative laminate systems are being developed. Various aspects of laminates and the current developments that are taking place are facilitating scientists and engineers in selecting appropriate laminate systems, have been discussed.

Defence Science Journal, 2011, 61(4), pp.354-363, DOI:http://dx.doi.org/10.14429/dsj.61.1085

Author Biographies

C. R. Raghunath, M.S. Ramaiah Institute of Technology, Bengaluru

Prof C.R. Raghunath received his BE (Electronics) from UVCE, Bengaluru in 1973 and MTech (Electronics) from IIT Madras, in 1980. Currently working as Professor in department of Electronics & Communication, MS Ramaiah Institute of Technology, Bengaluru. His area of specialization includes Microelectronics, printed circuit board, Radar and Microwave System Engineering. Present area of research includes Security technology, Application of microwaves and microelectronics for prediction of electrical short and food grain damage control. He is a member of the following academic bodies: IEEE Institute of Electrical & Electronics Engineers, SEE-Society of Electronic Engineers, Life Member of IMAPS India.

Punya Prabha V., M.S. Ramaiah Institute of Technology, Bengaluru

Ms Punya Prabha V. completed graduation (Electrical and Electronics engineering) from Mysore University, and post graduation (Digital Electronics) from Visvesvaraya Technological University in 2001 and 2007 respectively. Currently working as Assistant Professor in Department of Electronics & Communication, M.S. Ramaiah Institute
of Technology, Bengaluru. Her areas of interest include Computer communication networks, power electronics, network analysis, data communication, operational research and management.

H. S. Yeshaswini, M.S. Ramaiah Institute of Technology, Bengaluru

Ms Yeshaswini H.S. received her BE (Electronics and Communication Engineering) from Sapthagiri college of Engineering, Bengaluru in 2010. Currently working as a Project Engineer for a sponsored project in M.S. Ramaiah Institute of Technology, Bengaluru. Her area of interest includes signal processing and embedded systems.

H. Rashmi, M.S. Ramaiah Institute of Technology, Bengaluru

Ms Rashmi H. did BTech (Electronics and Communication Engineering) from Amrita School of Engineering, Bengaluru in 2008. Currently pursuing MTech (Digital Electronics and Communication) at M.S. Ramaiah Institute of Technology, Bengaluru. Her areas of interest include signal processing.

T. N. Sushma, M.S. Ramaiah Institute of Technology, Bengaluru

Ms Sushma T.N. received her BE (Electronics and Communication Engineering) from GM Institute of Technology, Davangere in 2010. Currently pursuing MTech (Digital Electronics and Communication) at M.S. Ramaiah Institute of Technology, Bengaluru and her area of interest includes embedded systems.