1.
Rawal D, Agarwal V, Sharma H, Sehgal B, Muralidharan R. Dry Etching of GaAs to Fabricate Via-Hole Grounds in Monolithic Microwave Integrated Circuits. DSJ [Internet]. 1Jul.2009 [cited 19Sep.2020];59(4):363-70. Available from: https://publications.drdo.gov.in/ojs/index.php/dsj/article/view/1535