Mukherjee, G.S., N. Shukla, R.K. Singh, and G.N. Mathur. “Thermoplastic Epoxide Resin in the Presence of Polyethylene Glycol As Hot-Melt Adhesive in Clean Technology”. Defence Science Journal 54, no. 2 (April 1, 2004): 249-255. Accessed March 30, 2020. https://publications.drdo.gov.in/ojs/index.php/dsj/article/view/2038.