RawalD.S., AgarwalV.R., SharmaH.S., SehgalB.K., and MuralidharanR. “Dry Etching of GaAs to Fabricate Via-Hole Grounds in Monolithic Microwave Integrated Circuits”. Defence Science Journal 59, no. 4 (July 1, 2009): 363-370. Accessed September 21, 2020. https://publications.drdo.gov.in/ojs/index.php/dsj/article/view/1535.