Rawal, D.S., V.R. Agarwal, H.S. Sharma, B.K. Sehgal, and R. Muralidharan. “Dry Etching of GaAs to Fabricate Via-Hole Grounds in Monolithic Microwave Integrated Circuits”. Defence Science Journal 59, no. 4 (July 1, 2009): 363-370. Accessed April 25, 2024. https://publications.drdo.gov.in/ojs/index.php/dsj/article/view/1535.