Rawal, D., Agarwal, V., Sharma, H., Sehgal, B. and Muralidharan, R. (2009) “Dry Etching of GaAs to Fabricate Via-Hole Grounds in Monolithic Microwave Integrated Circuits”, Defence Science Journal, 59(4), pp. 363-370. doi: 10.14429/dsj.59.1535.