| || 3D MCM Technology for miniaturisation of an electronic system
Author : Bhowmick, S. K.
Source : Defence Science Journal ; Vol:56(1) ; 2006 ; pp 47-52
Subject : 629.7 Aeronautics;621.38 Electronics
Keywords : Miniaturisation;SIP;MCM technology;SOC;Multi chip module;System in a package;System on a chip;Packaging technology;System miniaturisation;Electronic systems
Abstract : Miniaturisation of a bulky system requires effective use and integration of modern packaging technology to achieve smaller size and lighter weight while consuming low power and achieving high speed. Using three-dimensional packaging technology, a system can be miniaturised to a small package popularly known as system-in-a-package (SIP). Various layers of component integration (die or packaged) in the horizontal and vertical directions lead to a compact system in a single package. In this paper, the development of an analog multi-chip module (MCM) is illustrated using 3-D technology. The major goals achieved using this technology are the mixed-signal integration, area/size reduction, and low power. A comparison is made with the system-on-a-chip (SOC) technology and their merits and demerits are also discussed.